You can view the data center temperature map in a 2D floor layout with various views.
In the Cooling overlay of the data center floor layout, you can see a color-coded overview the Capture Index (CI). You can use this view to get an overview of the reasons why the tile airflow may not be the same across the room. You can simulate where to place equipment without overheating the room or creating hotspots by following the color-coded indications, for example position new devices and move or delete existing devices without exceeding recommended exhaust air captured by the cooling units.
Subsequently, you can use the plenum overlays to drill down into looking at specific pressure or velocity issues in the plenum.
Each rack in a well-formed hot aisle/cold aisle layout shows a color-coded capture index (CI) percentage. The CI value identifies inlet air which is supplied by what fraction of the equipment's exhaust airflow is captured by the InRow® cooling units included in that row pair or by the CRAC or CRACs in the room through the perforated tiles.
Select the Cooling tab in the floor layout.
- Add CRACs, InRow® cooling units and perforated tiles as needed by dragging them from the Genomes pane into the layout.
- Review or modify the cooling settings of the added equipment or the room as needed by right-clicking the item, and selecting Properties, and using the settings in the Cooling page.
- Simulate failure of one or more cooling units by selecting one or more cooling units in the floor layout, right-clicking, and deselecting Activate.
Simulate cooling performance changes of one or more racks by selecting one or more racks in the floor layout, right-clicking and selecting Cooling>Normal: 160 CFM/kW, Blade: 105 CFM/kW or another value*, if available.
To select more than one cooling unit, hold down the Ctrl key and select the items, or drag a box around the items you want to select.
*Value defined in the Rack's cooling properties page.